摘要平面微弹簧以其尺寸小、质量轻、功耗低、成本低、可靠性高、抗振动冲击能力强等特点在各个领域都得到了应用,被认为是一种具有前途的零件。本文使用DEFORM软件对铜合金平面微弹簧挤压过程进行了模拟分析,揭示了试样变形过程中的有效应力场,有效应变场以及载荷变化规律。对挤压比,摩擦系数,温度以及挤压速度对最终晶粒尺寸的影响进行了简要分析。发现最终晶粒尺寸随着挤压比的增加,摩擦系数的增加,温度的增加以及挤压速度的增加而减小。20799
关键词:铜合金 微弹簧 挤压成型 微观组织演变 毕业论文设计说明书(论文)外文摘要
Title The microstructure evolution during the extrusion Forming of the micro spring in copper alloy
Abstract
Micro spring with its small size, light mass, low power consumption, low cost, high reliability, strong ability to resist shock vibration characteristics have been applied in every field, is considered a promising parts. In this paper, using the DEFORM software to simulate and analysis the extrusion process of copper alloy surface micro spring, reveals the specimen deformation in the process of effective stress field, effective strain field and load variation. The influence of the extrusion ratio, friction factor, temperature and extrusion speed on the final grain size are briefly analyzed. Found that the grain size reduce with the growth of extrusion ratio, friction factor temperature and extrusion speed.
Keywords Copper alloy,Micro spring,Extrusion forming,Microstructure evolution
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