摘要： 中空玻璃微球具有比表面积小、密度低、化学稳定性好等特点。而且还具有耐压强度高的特性。基于中空玻璃微球的低密度特性，将中空玻璃微球表面进行金属化处理，能够大大降低金属材料的用量，该材料有望用于导电涂层，用于导电或使涂层产生屏蔽功能。铜是具有高导电特性的金属，本论文尝试采用化学镀铜的方法在中空玻璃微球表面进行镀铜的工艺探索。通过控制变量的方法改变实验中的空心玻璃微球的投料量、敏化时间、敏化-活化次数、施镀时间、施镀温度等化学工艺条件，获得完整包覆铜镀层的中空玻璃微球。最终通过扫描电镜与EDX分析确定出最佳的工艺条件为除油30min，敏化20min，活化15min，敏化-活化两次，20℃下化学镀铜25min。

关键词： 中空玻璃微球；敏化；活化；化学镀铜；扫描电镜

Electroless copper plating of hollow glass microspheres

Abstract: Hollow glass microspheres have characteristics such as small specific surface area, low density, and good chemical stability. It also has high pressure strength characteristics. Based on the low density characteristics of the hollow glass microspheres, the surface of the hollow glass microspheres can be metallized, which can greatly reduce the amount of metal materials. This material is expected to be used in conductive coatings for conducting or shielding the coating. Copper is a metal with high electrical conductivity. In this thesis, we tried to apply copper plating on the surface of hollow glass microspheres for copper plating. By changing the method of controlling the variables, the amount of the hollow glass microspheres in the experiment, the sensitizing time, the number of times of sensitization-activation, the plating time, the plating temperature and other chemical process conditions are changed, and the hollow glass microspheres with intact copper-clad coating are obtained. Finally, the best process conditions were determined by scanning electron microscopy and EDX analysis: deoiling for 30 min, sensitization for 20 min, activation for 15 min, sensitization-activation twice, and electroless copper plating for 25 min at 20°C.

Keywords: Insulating glass microspheres; Sensitization; Activation; Electroless copper plating; Scanning electron microscope

目录

1 引言 1

1.1 选题背景 1

1.2 表面导电化方法 1

1.3 中空玻璃微球表面化学镀铜 2

1.4 化学镀铜机理 2

1.4.1 甲醛还原铜机理 2

1.4.2 次磷酸钠还原铜机理 3

1.5 化学镀铜工艺 4

1.6 化学镀铜成分和工艺条件 6

1.6.1 化学镀铜溶液的组成 6

1.6.2 工艺条件 8

1.6.3 化学镀铜液的维护 9

1.7 选题意义 9

2 实验部分 10

2.1 实验方案 10

2.2 实验路线 10

2.3 实验试剂与材料 10

2.4 实验仪器与设备 11

2.5 实验流程 12

2.5.1 实验前处理 12

2.5.2 化学镀铜镀液的配制 12

2.5.3 中空玻璃微球表面施镀