倒装集成LED光源光电性能研究
毕业论文关键词：倒装LED，集成光源，光电性能
Flip chip integrated LED light source photoelectric performance study
AbstractLight-emitting diode (LED) as a new type of green lighting light source, energy saving, high efficiency, low carbon, the advantages of small volume, fast response, strong vibration resistance, can provide users with environmental protection, stable, efficient and safe new lighting experience, has gradually developed into a mature semiconductor lighting industry. And flip chip LED due to the nature of his heat dissipation performance and convenient integration plays an important role in the LED market. Analysis of flip chip integrated LED is imminent. In the flip chip integrated LED chip manufacturing and packaging process, in addition to deal with stable and reliable electrical connection, you also need to deal with the issue of light. This paper first studied the three different encapsulation of LED light source in the form of photoelectric performance comparison. Then current effect the performance of the inversion of the LED light source photoelectric did the research. And the problems in the process of research, namely heat made mainly analyzes the influence of the optical performance. Flip chip integrated LED photoelectric performance and current and closely related with the current rise of chip temperature.
KeyWords：Flip chip LED, Integrated light source photoelectric performance
目录 1
目录...2
第一章 绪论 ...5
1.1 课题背景 5
1.2 倒装LED技术的发展及现状 5
第二章 LED的封装形式 8
2.1三种封装形式 8
2.1.1正装LED 8
2.1.2垂直LED 8
2.1.3倒装LED 10
2.2倒装芯片的优势.10
2.3不同封装形式对比实验 11
2.3.1实验目的 11
2.3.2实验原理 11
2.3.3测试方法 11
2.3.4结果与讨论 11
2.3.5色温测试 14
2.4 结论 14
第三章 倒装集成LED 14
3.1倒装LED的制备工艺 14
3.1.1蓝宝石衬底和GaN外延工艺技术 15
3.1.2倒装LED圆片制程工艺 15
3.1.3倒装LED芯片后段制程 16
3.2 倒装LED的集成方式 16
3.2.1 贴片灯珠 16
3.2.2COB封装 17
3.2.3 贴片灯珠 17
3.3 倒装集成LED的光学特性 18
3.3.1 发光法向光强及其角分布 18
3.3.2 发光峰值波长及其光谱分布 18
3.3.3光通量 19
3.3.4发光效率和视觉灵敏度 19
3.3.5光通量 20
3.3.6发光效率和视觉灵敏度 21