软硬件名称、内容及主要的技术指标(可按以下类型选择): 计算机软件
图 纸
电 路 板
机 电 装 置
材料制剂
结 构 模 型
其 他
五、查阅文献要求及主要的参考文献:
[1] Z. Wen, S. Huang, X. Zhu, Z. Gu, Electrochem Commun 6 (2004) 1093-1097.
[2] T. Ohzuku, A. Ueda, N. Yamamoto, Y. Iwakoshi, Journal of power sources 54 (1995) 99-102.
[3] S. Scharner, W. Weppner, P. Schmid‐Beurmann, Journal of the Electrochemical Society 146 (1999) 857-861.
[4] S. Huang, Z. Wen, J. Zhang, Z. Gu, X. Xu, Solid State Ionics 177 (2006) 851-855.
[5] J.S. Park, S.-H. Baek, Y.-I. Jeong, B.-Y. Noh, J.H. Kim, Journal of Power Sources 244 (2013) 527-531.
[6] C. Lin, M.O. Lai, L. Lu, H. Zhou, Y. Xin, Journal of Power Sources 244 (2013) 272-279.
[7] T. Ohzuku, A. Ueda, N. Yamamoto, Journal of the Electrochemical Society 142 (1995) 1431-1435.
[8] H. Wu, S. Chang, X. Liu, L. Yu, G. Wang, D. Cao, Y. Zhang, B. Yang, P. She, Solid State Ionics 232 (2013) 13-18.
[9] M. Vujković, I. Stojković, M. Mitrić, S. Mentus, N. Cvjetićanin, Materials Research Bulletin 48 (2013) 218-223.