摘要：管泡T30作为造型最像传统白炽灯的仿古LED灯，要求像钨丝一样可以全角度出光，由于光源是密封在玻璃泡内的，所以对 LED 灯丝的散热性能提出了要求。一般的LED灯丝球泡灯基本上用的是正装芯片，主要封装材料（绝缘胶、陶瓷基板、玻璃基板等）的散热性能都不理想，这将导致 LED 的结温过高无法达到预想的节能目的。并且正装 LED 的金线容易受到表面硅胶热膨胀带来的影响，制约了 LED 灯丝的发展。倒装芯片在结构上优化了散热通道，能够提升灯丝的散热性能。使用倒装芯片制备灯丝的固晶方式主要有两种：金锡共晶与锡膏回流焊。金锡共晶的方法存在封装设备昂贵，工艺复杂等问题。目前 LED 灯丝灯相比传统节能灯价格较高，要想 LED 灯丝普及化，需要降低 LED 灯丝的成本、提升散热性能，这对封装工艺提出了更高的要求。 

管泡T30内部的LED光源是由数根串联或者串并联的LED灯丝条组成。LED灯丝又叫LED灯柱，是360°打光的立体光源。LED灯丝主要是通过蓝光芯片、红光芯片、黄绿粉封装来实现白光发光的。此外，LED灯丝球泡灯发使用的是全透明材质，360°无死角封装，优良率高。LED灯丝球泡灯在现今应该是比较高效的新型光源，这款管泡T30显色指数Ra能达到80以上,光效也相当不错几乎能保持在100 lm/W以上。

LED灯丝灯的驱动放置在金属灯头内，通过热缩套管等绝缘件与金属灯头进行电隔离。通常，LED灯丝灯的驱动电源分为两种：线性恒流电源和IC恒流电源。线性恒流电源的电流不随电压的变化而变化；IC恒流电源是通过IC对采样电阻的检测实现对开关管进行打开、关断控制实现恒流。

关键词： 

LED、管泡T30、光学性能、ProE、FloEFD

Study on the Photothermal Properties

of Tube Bubble T30

Abstract: Tube type bulb as a special shape of the lighting source, requires the same as the tungsten light can be full-angle light, because the light source is sealed in the glass bubble, so  the LED filament heat dissipation performance requirements.  Traditional LED filaments use positive-fitting chips, and the heat dissipation performance of the main packaging materials (insulation glue, ceramic substrate, glass substrate, etc.) is not ideal, which will lead to LED junction temperature too high to achieve the desired energy-saving purposes.  Moreover, the gold wire of the LED mounted is susceptible to the thermal expansion of the surface of the silicone, which restricts the development of the LED filament.  The flip chip has optimized the structure of the heat dissipation channel and can improve the heat dissipation performance of the filament. There are mainly two types of die-bonding methods used for flip-chip fabrication of filaments: gold-tin eutectic and solder paste reflow soldering.  The gold-tin eutectic method has the problems of expensive packaging equipment and complicated process. Currently, LED filament lamps have higher prices than traditional energy-saving lamps. In order to popularize LED filaments, it is necessary to reduce the cost of LED filaments and improve the heat dissipation performance. This raises higher requirements for the packaging process. 

The LED light source is composed of a plurality of series or parallel LED filament filaments.LED filament is also called LED lamp post, which is a 360-degree light source. The LED filaments mainly emit light by means of a blue chip, a red chip, and a yellow-green powder package. In addition, the LED filament uses a fully transparent substrate material with a new 360° molding and packaging process, resulting in a high yield. The LED filament is a high quality light source with a color rendering index above 90 and a luminous efficacy of 110 lm/W.

The driver of the LED filament lamp is placed in the metal lamp cap and is electrically isolated from the metal cap by an insulating member such as a heat shrinkable sleeve.  In general, the LED filament lamp driver power is pided into two types: linear constant current power supply and IC constant current power supply.  The current of the linear constant current power supply does not change with the change of voltage; IC constant current power supply realizes the constant current by turning on and off the switch tube through the detection of the sampling resistance by the IC.