摘要:化学镀镍化学镀镍合金它具有优秀的耐磨性、耐蚀性、装饰性、磁屏蔽性,而且镀层均匀,与基体结合力好。不同的化学镀镍工艺的镍沉积速度有快有慢,沉积速度快的溶液能提高生产效率。所以,为了提高镀液的沉积速度,增加镀液的稳定性,研究化学镀镍沉积速度的因素具有很重要的意义。本文通过化学镀镍的反应,经历了一系列的实验步骤,如改变络合物,温度、pH、镍离子浓度、还原剂等条件的实验中,考察出了影响化学镀镍沉积速度的各种工艺条件的最佳沉积速度。结果表明:40g/L硫酸镍,35g/L次磷酸钠,30g/L柠檬酸三铵,pH= 9,镀液温度45℃,在此工艺条件下,镀液拥有优异的稳定性,沉积速度更佳,镀层为晶态结构,表面均匀平整。21069 毕业论文关键词: 化学镀镍;沉积速度;工艺条件
Factors influencing the deposition rate of electroless plating nickel
Abstract: Chemical plating nickel chemical plating nickel alloy has good wear resistance, corrosion resistance, decorative, magnetic shielding, and uniform coating, good with substrate. Different chemical nickel plating technology of nickel deposit is fast or slow, sedimentary speed of solution can improve the efficiency of production. So, in order to improve the deposition rate of electroless plating solution, increase the stability of the plating solution, study of electroless nickel deposition rate factor has the very vital significance. In this paper, by the reaction of chemical nickel plating, through a series of experimental steps, such as complex changes, temperature, pH, nickel ion concentration, reducing agent such as condition of experiments, study the influence of various process conditions of electroless nickel deposition rate of the best deposition rate. Results show that: 40 g/L nickel sulfate, 35 g/L sodium hypophosphite, 30 g/L ammonium citrate, pH = 9, solution temperature 45 ℃, under the condition of the process, plating solution has excellent stability and deposition rate, coating to the crystalline structure, uniform surface is flat and level.
Keywords: Electroless nickel plating;Deposition rate;Process conditions