摘要:采用了赫尔槽试验的方法,探讨了以焦磷酸钾为主配合物,其他配合物以焦磷酸盐镀铜工艺为参考的镀液组成,以及阴极电流密度,镀液pH,镀液温度,预镀时间,添加剂等对镀液的影响,得到了一种新型的焦磷酸盐预镀铜镀液:焦磷酸铜5g/L,焦磷酸钾350g/L,柠檬酸铵25g/L,氨三乙酸30g/L,硝酸铵15g/L,磷酸氢二钠60g/L,氨水2ml/L,草酸30g/L,溶液的操作工艺条件为:电流密度0.5A/dm2,pH值为8.0~8.5,温度25℃,预镀时间10min。测定了预镀层与钢铁基体结合力,并且与之后的硫酸盐镀铜镀层结合力。可以用来代替预镀镍,以及主流的预镀氰化铜。其镀层结晶细致,平滑均匀,外观良好。镀层与钢铁结合力好,并且与随后的铜镀层结合力同样优秀。5020
关键词: 焦磷酸盐;镀铜;预镀铜;结合力; 毕业论文
Study on Pyrophosphate Copper Pre-plating
Abstract:Adopted the approach of hull cell test, mainly potassium pyrophosphate complexes are discussed, and the other complexes with pyrophosphate copper plating process for plating solution composition, reference and cathodic current density, electrolyte solution pH, the temperature of the plating solution, plating time, additives on the influence of the plating solution, obtained a new kind of pyrophosphate copper plating solution beforehand:Cu2P2O7: 5g/L,K4P2O7:350g/L,(NH4)3C6H5O7: 30g/L,N(CH2COOH)3:30g/L,NH4NO3:15g/L,Na2HPO4:60g/L,H2C2O4:30g/L,NH3•H2O:2mL/L.Operating process conditions for the solution: the current density of 0.5 A/dm2, pH value of 8.0 ~ 8.0, the temperature is 25 ℃, time of operating for 10 min. Determination of the coating and the steel substrate, in advance, and then the sulfate copper plating coating binding force. Can be used instead of nickel plating, as well as the mainstream of cyanide copper plating. The coating crystallization meticulous, smooth, uniform, appearance is good. Coating and steel binding force is good, and then the copper coating binding force as good.
KeyWords: pyrophosphate; Pre plating copper; Process parameters; Operating conditions; combination
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